V850 3D SPI

CATEGORY

ITEM

Specifications

Model

V850

Inspection System

Camera

Digital High Speed CCD 5M Pixel

Lamp-house

Ring R/G/B LED

FOV

36*36m(18μm）

Speed Per FOV

<0.6s

items

Solder/Red gum: Volume、Area、Height、Shape、Shift、Bridge、Overflow

Defects

Missing、Shift、Excessive, insufficient, Bridge、Pull、Collapse, Shape、Gold finger、Height、Overflow

Height Range

1~1000um

Area Range

0.15mm×0.15mm~10mm×10mm

Height Detection Resolution

0.37um

Height Accuracy on Certificated Target

1um

Height/Area/Volume Repeatability on a Certificated Target

<1%@3sigma

GR&R

<10%

Mechanism System

PCB Conveyor

Bottom-up fix; Auto transmit and width correct based on SMEMA; Height: 900±20mm

PCB Size

50x50mm~330x250mm

PCB Thickness

0.3~4.5mm

Max PCB Warp

<2mm

X,Y Platform

Driver

AC servo system

Orientation

<1μm

Moving Speed

700mm/s

Software System

Operation System

Microsoft Windows 7 X64

Control&

Recognizing

Characteristics

Dual 3D Projection(Single optional)avoid shadow and reflection

Operation

Graphic programming,  Chinese, English

Result

2D/3D true color

MARK

2 Common Marks can be chosen, or muti-marks can be chosen and skip function of array boards

Programming

Gerber 274D/X、CAD，Offline program，Bare Board Teach

Barcode Recognition

One dimensional code, 2D Barcode

MES Support

Standard port available

SPC

Offline SPC

Support

SPC Chart

Any Time Chart(（excel、jpg、bmp ），histogram and control chart to show volume、area、height、shift

Control System

Computer

Industrial computer：Intel Quad-core CPU Memory:8G，Hard disk:1TB

Display

19 inch TFT

Others

Air Supply

0.5MPA,40cm³/min

Machine Dimensions(L*W*H)

110x110x165cm

Weight

About 650 KG

Power Supply

AC220V±10%，50/60Hz，1200W

Working Environment

Temperature: 10-40℃，Humidity: 30-80%RH